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IDC MarketScape: Worldwide Mailroom Solutions and Services 2026 Vendor Assessment

Robert Palmer — Wed, 08 Jul 2026 04:00:00 GMT

This IDC study assesses the market for mailroom solutions and services among the most prominent global vendors and identifies their strengths and challenges. This assessment discusses both quantitative and qualitative characteristics that position vendors for success in this important market. This IDC study is based on a comprehensive framework to evaluate mailroom solutions and services, including standalone capabilities suitable for self-managed environments and outsourced mailroom services.

"As enterprises accelerate their shift to hybrid work models, the mailroom is emerging as a critical enabler of digital transformation, moving from a back-office cost center to an intelligent intake hub that drives speed, compliance, and operational resilience," says Robert Palmer, research VP, IDC's Imaging Domain. "Organizations should partner with mailroom solutions providers that combine physical and digital mail capabilities with AI-driven automation, robust governance frameworks, and seamless enterprise integration to ensure secure, efficient, and auditable information flows across distributed workforces."

IDC Survey: Telco Transformation, 2026: Global Telecom AI Plans and Strategy Highlights

Peter Chahal — Tue, 07 Jul 2026 04:00:00 GMT

This IDC Survey draws on two April 2026 IDC primary research surveys: the Worldwide Telco DX Network Infrastructure and Cloud Survey (n = 318) and the Worldwide Telco DX IT Applications and AI Survey (n = 350), covering telecom decision-makers across more than 60 countries and five regions. IDC finds that telecom providers have moved decisively from AI strategy to execution, investing in parallel across infrastructure, talent, services, and partnerships with the emphasis firmly on building foundations at scale. GenAI is scaling fastest where operators have the most control: network operations and automation (with AIOps now mainstream). Customer-facing monetization remains 12 to 24 months behind, meaning that operators that get the foundations right today will lead the next wave of AI-driven revenue growth.

What separates the leaders from the rest is not access to better models; it is data readiness, security posture, and the ability to orchestrate a fragmented, multivendor AI stack across a network infrastructure that differs by region. With no single global playbook, telcos’ AI strategy is shaped by local regulation, sovereignty mandates, and ecosystem maturity. The full survey findings reveal exactly where the gaps are widest, which regions are moving fastest, and what the operators pulling ahead are doing differently.

Infosec Europe 2026: AI Is Everywhere, But Core Security Capability Still Dominates the Market

Duncan Brown, Mark Child — Tue, 07 Jul 2026 04:00:00 GMT

This IDC Market Note looks at some of the key insights gleaned from three days of interviews between the IDC team and the security vendor and service provider experts at Infosec Europe 2026. The event showcased the latest advances in cybersecurity and AI, with vendors presenting innovative solutions for observability, identity management, supply chain risk, and managed detection and response. Interviews revealed a strong emphasis on AI governance, operational transparency, and compliance with European regulations.

"European enterprises are accelerating AI adoption, demanding security solutions that balance innovation, governance, and regulatory compliance," says Duncan Brown, group vice president, Worldwide Security Products, Worldwide Sustainability at IDC.

Japan J-LEO D2C Govt Project Opts for Rakuten/AST SpaceMobile over KDDI/SpaceX

Simon Baker — Tue, 07 Jul 2026 04:00:00 GMT

T Project subsidizes disaster recovery LEO satellite infrastructure open to all telecoms players in Japan under mandate of local ownership and control. It requires national service with video calling capabilities and service by early 2029. The decision is an important boost to AST SpaceMobile and its positioning as a 'cellular tower in the sky' operator able and willing to work as a neutral infrastructure player.

Market Share: Worldwide Semiconductor Manufacturing Services: Top 10 Outsourced Semiconductor Assembly and Test Market — Vendor Ranking and Insight, 2025

Galen Zeng — Tue, 07 Jul 2026 04:00:00 GMT

The outsourced semiconductor assembly and test (OSAT) industry continued its strong recovery in 2025, driven by a surge in AI computing demand. The worldwide OSAT market size reached US$47.2 billion in 2025, up 13.9% year over year (YoY), which is a significant increase from its 6.4% YoY growth in 2024. Driven by sustained growth in AI and high-performance computing (HPC) demand, OSAT vendors are not only solidifying their development in traditional packaging technologies but also making breakthroughs in advanced packaging (such as 2.5D/3D packaging), further expanding their service scope to meet diverse customer needs.

This IDC study examines worldwide OSAT market shares in 2025 and provides insights into the key drivers and dynamics impacting the market. IDC has the following observations on the worldwide OSAT market in 2025:

AI adoption is now the key growth engine for the sector, unlocking explosive demand for 2.5D/3D advanced packaging. This demand has directly translated into significant revenue growth for OSAT companies. A prime example is chip-on-wafer-on-substrate (CoWoS)–related technologies, in which capacity shortages are currently constraining supply.
China OSAT vendors (e.g., Wise Road Capital, SJ Semiconductor) have demonstrated remarkable growth with significant increases, supported by the demand for semiconductor self-sufficiency. Their overall growth rate exceeds that of the global average.
The worldwide capacity landscape is rapidly diversifying. The "Taiwan + 1" and "China + 1" strategies are being fully implemented, with Southeast Asia (Malaysia, Vietnam, and Singapore), the Americas (Arizona and Mexico), and South Asia (India) continuing to attract capacity investments.
Taiwan Semiconductor Manufacturing Company's (TSMC) advanced packaging business continues to expand, with significant increases in capacity for CoWoS and system-on-integrated-chips (SoIC) technologies. Its advanced packaging revenue is projected to reach approximately US$12 billion in 2025, positioning it as the second largest advanced packaging business globally.

"Fueled by the AI wave, the OSAT market posted a 13.9% YoY growth in 2025, marking its highest growth rate in nearly five years," says Galen Zeng, senior research manager on semiconductor research, IDC Asia/Pacific. Zeng adds, "Advanced packaging has evolved from a supporting role in the semiconductor industry to a core engine driving overall growth. Looking ahead to 2026, with continued datacenter expansion, the rapid rise of agentic AI adoption, and the recovery of mainstream packaging driven by the AI integration in endpoint devices, the OSAT market is expected to grow by 15.3% YoY. Vendors must focus on three key areas: investment in advanced packaging, distribution of worldwide production capacity across regions, and early-stage design collaboration with fabless companies. Concurrently, the potential impact of geopolitical upheavals on energy and raw material supply chains cannot be ignored. The only way for companies to sustain their advantage in this rapidly evolving environment is to adopt a comprehensive response strategy."

NSA and Army Launch QuantumEAGLe to Deepen Federal Engagement with the U.S. Quantum Computing Industry

Heather West, PhD — Tue, 07 Jul 2026 04:00:00 GMT

NSA and the U.S. Army's launch of the QuantumEAGLe initiative marks a shift in how the U.S. government engages the quantum computing industry, moving from funding research at a distance to working directly with vendors through flexible contracting authority. It lands amid a broader acceleration in federal quantum activity in 2026 that IDC believes is reshaping expectations for how quickly government demand translates into commercial market growth.

NVIDIA GTC 2026: Built for Agents — NVIDIA’s Full-Stack AI Strategy

Helen Chiang, Jeff Janukowicz, Galen Zeng — Tue, 07 Jul 2026 04:00:00 GMT

This IDC study discusses highlights from GTC Taipei 2026, where NVIDIA declared that AI is shifting from responding to acting, with agentic computing as the new workload. To lead this shift, NVIDIA unveiled a full-stack strategy built around the “AI factory” concept, producing intelligence at the lowest token cost. Key launches included the Vera Rubin platform, Vera CPU, Spectrum-X Ethernet Photonics, and the DSX platform, which is a turnkey playbook for building and operating AI factories. From IDC’s perspective, competition is moving beyond chips to full-stack capability, and DSX could ultimately become the defining standard for AI factory architecture — a moat potentially more enduring than CUDA itself.

Omnea Advances Spend Orchestration with MCP Integration and Tropic Price Intelligence Partnership

Patrick Reymann — Tue, 07 Jul 2026 04:00:00 GMT

Production and Large Format Print Applications

Tim Greene — Tue, 07 Jul 2026 04:00:00 GMT

This IDC Market Presentation highlights the application-related findings around the applications that production and large format printing organizations are both commonly and primarily printing. The findings are important as the applications are what drives volume, and enabling additional applications is important for equipment manufacturers.

Rocket Lab Acquisition of Iridium: Legacy LEO Taken off the Table, Will Not Radically Change Satellite Landscape

Simon Baker — Tue, 07 Jul 2026 04:00:00 GMT

Rocket Lab's purchase of Iridium follows on from Amazon's acquisition of Globalstar and marks the takeover of the second of the original LEO satellite systems from the 1990s. While in outline this takeover creates an integrated company capable of launch, satellite manufacture and operation, the combined entity will take years to realize these synergies and cannot in the short term be considered a close competitor of SpaceX Starlink or Amazon LEO.