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Market Share: Worldwide PC Shares, 1Q26 — Shipment Pull-In Continued

Bryan Ma — Fri, 10 Jul 2026 04:00:00 GMT

This IDC presentation examines the 1Q26 market shares of the leading vendors in the worldwide PC market.

“PC shipments in the first quarter continued to be front-loaded as buyers concerned about the memory shortage grabbed units earlier in the year in order to beat looming price hikes. This drove the market up 3% in 1Q26.” — Bryan Ma, vice president, Client Devices

Market Share: Worldwide Semiconductor Manufacturing Services: Top 10 Outsourced Semiconductor Assembly and Test Market — Vendor Ranking and Insight, 2025

Galen Zeng — Fri, 10 Jul 2026 04:00:00 GMT

The outsourced semiconductor assembly and test (OSAT) industry continued its strong recovery in 2025, driven by a surge in AI computing demand. The worldwide OSAT market size reached US$47.2 billion in 2025, up 13.9% year over year (YoY), which is a significant increase from its 6.4% YoY growth in 2024. Driven by sustained growth in AI and high-performance computing (HPC) demand, OSAT vendors are not only solidifying their development in traditional packaging technologies but also making breakthroughs in advanced packaging (such as 2.5D/3D packaging), further expanding their service scope to meet diverse customer needs.

This IDC study examines worldwide OSAT market shares in 2025 and provides insights into the key drivers and dynamics impacting the market. IDC has the following observations on the worldwide OSAT market in 2025:

AI adoption is now the key growth engine for the sector, unlocking explosive demand for 2.5D/3D advanced packaging. This demand has directly translated into significant revenue growth for OSAT companies. A prime example is chip-on-wafer-on-substrate (CoWoS)–related technologies, in which capacity shortages are currently constraining supply.
China OSAT vendors (e.g., Wise Road Capital, SJ Semiconductor) have demonstrated remarkable growth with significant increases, supported by the demand for semiconductor self-sufficiency. Their overall growth rate exceeds that of the global average.
The worldwide capacity landscape is rapidly diversifying. The “Taiwan + 1” and “China + 1” strategies are being fully implemented, with Southeast Asia (Malaysia, Vietnam, and Singapore), the Americas (Arizona and Mexico), and South Asia (India) continuing to attract capacity investments.
Taiwan Semiconductor Manufacturing Company’s (TSMC) advanced packaging business continues to expand, with significant increases in capacity for CoWoS and system-on-integrated-chips (SoIC) technologies. Its advanced packaging revenue is projected to reach approximately US$12 billion in 2025, positioning it as the second largest advanced packaging business globally.

“Fueled by the AI wave, the OSAT market posted a 13.9% YoY growth in 2025, marking its highest growth rate in nearly five years,” says Galen Zeng, senior research manager on semiconductor research, IDC Asia/Pacific. Zeng adds, “Advanced packaging has evolved from a supporting role in the semiconductor industry to a core engine driving overall growth. Looking ahead to 2026, with continued datacenter expansion, the rapid rise of agentic AI adoption, and the recovery of mainstream packaging driven by the AI integration in endpoint devices, the OSAT market is expected to grow by 15.3% YoY. Vendors must focus on three key areas: investment in advanced packaging, distribution of worldwide production capacity across regions, and early-stage design collaboration with fabless companies. Concurrently, the potential impact of geopolitical upheavals on energy and raw material supply chains cannot be ignored. The only way for companies to sustain their advantage in this rapidly evolving environment is to adopt a comprehensive response strategy.”

Enterprise Procurement and Partnership in the Age of AI and Outcome-Based Connectivity — Analysis by Region

Paul Hughes — Thu, 09 Jul 2026 04:00:00 GMT

This IDC Perspective is the first in a series of three documents that examine how businesses expect to procure connectivity services and related transformation projects in the era of AI and outcome-based connectivity. Drawing on IDC's 2025 Enterprise Connectivity Infrastructure and Services Survey and other related IDC data sources, this IDC Perspective identifies regional differences for connectivity provider preferences and procurement methods across North America, Europe, and APAC.

"Regional procurement patterns reveal that geography still shapes how enterprises source and evaluate connectivity," commented Paul Hughes, research director, Future Enterprise Connectivity Strategies at IDC. "This comes even as the underlying provider competition converges globally and as AI leadership from the supplier community differs in depth, perspective, and approach."

IBM Content Cortex: Turning Decades of Content Services Investment into an Agentic AI Asset

Amy Machado — Thu, 09 Jul 2026 04:00:00 GMT

IDC Survey: Sustainability Software Usage Trends 2026

Amy Cravens — Thu, 09 Jul 2026 04:00:00 GMT

This IDC Survey examines how organizations buy and use sustainability software in 2026 and where the market is heading through 2027. Sustainability software has matured from a compliance-driven reporting tool into a broad operational platform — spanning data management, supply chain, performance tracking, and day-to-day operations. Drawing on 816 organizations across 17 countries and 15 industries, IDC finds usage is led by data management and integration (56%), sustainable supply chain and procurement (54%), and performance tracking (53%), with adoption widening as companies scale and concentrate in software, energy, and financial services. AI, GenAI, and agentic AI rank as the highest-impact emerging technology for the next three years (69%), and investment intent is near universally centered on AI-driven automation and analytics and on data quality and governance, against an average annual spend of roughly $1.4 million. Vendors that pair broad platform reach with functional depth, and that frame value in both financial and compliance terms, are best positioned in a market where budgets are still growing.

"Sustainability software is no longer where companies simply tally their emissions; it's becoming the operating layer for how they run leaner, cleaner, and smarter. The organizations embedding AI into these workflows today are turning a reporting obligation into an operational edge, and the distance between them and everyone else is widening. For vendors, the mandate is clear: integrate the data, go deep by industry, and prove the return." — Amy Cravens, research manager, Sustainability/ESG Software, IDC

Market Forecast: Worldwide Service Provider Routing Equipment Forecast, 2026–2030 — SP Routing Investment Growth Driven by AI Supercycle and Strong Momentum in AI and Cloud Providers

Ajeet Das — Thu, 09 Jul 2026 04:00:00 GMT

This IDC presentation provides the five-year forecast for the worldwide service provider routing equipment market and delivers insights into the drivers and inhibitors of growth.

“The service provider (SP) router market is growing, fueled by the AI supercycle and investment in network upgrades to support the high volume of network traffic. While the transition to 800G and 1.6T architectures is accelerating to meet the demands of AI-native traffic and “agentic AI” bursts, providers are simultaneously grappling with an “AI tax” on silicon and stagnant ARPU. This dual reality is forcing a shift toward more flexible, cloud-native architectures and a growing reliance on the circular economy to manage soaring total cost of ownership (TCO).” — Ajeet Das, research director, Telecom Infrastructure

Market Share: Worldwide Enterprise Workload Infrastructure Shares, 2025

Max Pepper, Natalya Yezhkova, Kuba Stolarski — Thu, 09 Jul 2026 04:00:00 GMT

This IDC presentation provides historical market share data (2024–2025) for the worldwide enterprise workload infrastructure (server, enterprise storage systems, and hyperconverged infrastructure) market. This historical data illustrates top enterprise infrastructure vendor shares overall and by workload category. IDC reports these vendor shares in terms of vendor revenue.

“2025 saw demand for infrastructure to support AI-intensive workloads — particularly AI life cycle and text and media analytics — exponentially increase as we saw not only continued AI development, but the rapid proliferation of AI deployment. AI is quickly becoming a factor driving market spending throughout all workloads as organizations seek greater workload efficiency, even as market uncertainty has become and continues to be a growing concern for organizations.” — Max Pepper, senior research analyst, Enterprise Workloads and Core Infrastructure, IDC

Quantum Risk Is Already Here: A Provider’s Guide to Demonstrating Third-Party Cryptographic Readiness Before Q-Day, Part 1 — Situation and Strategic Guidance

Philip D. Harris, CISSP, CCSK — Thu, 09 Jul 2026 04:00:00 GMT

This IDC Market Perspective discusses the need for third-party post-quantum readiness. The quantum threat to enterprise data security is not a future risk — it is a present, compounding threat across two dimensions. Harvest now, decrypt later (HNDL) attacks are collecting encrypted data today for retroactive decryption. Trust now, forge later (TNFL) — introduced by IDC as the authentication-layer counterpart to HNDL — describes adversaries harvesting signed artifacts currently to retroactively forge provenance records that organizations and regulators cannot distinguish from authentic ones. With NIST finalizing three PQC standards in August 2024, CISA issuing federal procurement guidance in January 2026, and NIST IR 8547 proposing to deprecate and ultimately disallow quantum-vulnerable asymmetric algorithms by 2030 and 2035, respectively, the regulatory landscape has converted migration from a planning exercise into a compliance obligation.

This document is part 1 of a two-part IDC Market Perspective series. It establishes the strategic and threat context for PQC readiness in third-party risk management — including the HNDL and TNFL threat dimensions, Mosca’s inequality prioritization framework, emerging Quantum Security Posture Management and Quantum TRiSCM operating models, and the five quantum governance dimensions and trust KPIs that mature programs are adopting. Quantum Risk Is Already Here: A Provider’s Guide to Demonstrating Third-Party Cryptographic Readiness Before Q-Day, Part 2 — Assessment Framework and Deployment Guide (IDC #US54672326, forthcoming) delivers the complete 48-question Third-Party Quantum Encryption Readiness Assessment Framework. Providers that cannot demonstrate a credible migration posture across both encryption and authentication now risk material findings before formal mandates arrive.

“Two clocks are running simultaneously for every technology provider. The first is the HNDL clock; data encrypted currently under quantum-vulnerable algorithms is potentially readable within a decade, and it cannot be re-encrypted retroactively. The second is the TNFL clock: every artifact signed currently under a quantum-vulnerable key extends the attack surface that adversaries will exploit once quantum computers have advanced to the point of breaking standard encryption. Neither clock can be paused. The only rational response is to treat PQC migration not as a future project but as the most time-sensitive infrastructure program your organization has ever run — and to build the governance, inventory, and crypto-agility foundations before your customers ask for them,” says Philip D. Harris, CISSP, CCSK, research director, Governance, Risk, and Compliance Solutions at IDC.

Quantum Risk Is Already Here: An Enterprise Buyer's Guide to Assessing Third-Party Cryptographic Readiness Before Q-Day, Part 1 — Situation and Strategic Guidance

Philip D. Harris, CISSP, CCSK — Thu, 09 Jul 2026 04:00:00 GMT

This IDC Perspective discusses the need for third-party post-quantum readiness. The quantum threat to enterprise data security is not a future risk — it is a present liability that is compounding across your third-party vendor portfolio. Harvest now, decrypt later (HNDL) attacks are collecting data that your vendors encrypt today for retroactive decryption once quantum computers mature. Trust now, forge later (TNFL) — introduced by IDC as the authentication-layer counterpart to HNDL — describes adversaries harvesting signed vendor artifacts currently to retroactively forge provenance records that your organization and your regulators cannot distinguish from authentic ones. With NIST finalizing three PQC standards in August 2024, CISA issuing federal procurement guidance in January 2026, and NIST IR 8547 proposing to deprecate quantum-vulnerable asymmetric algorithms after 2030 and disallow them after 2035, the regulatory landscape has converted PQC migration from a planning exercise into a third-party compliance obligation you cannot defer to your vendors.

This document is part 1 of a two-part IDC Perspective series for enterprise buyers. It establishes the strategic and threat context for deploying a PQC readiness assessment program across your third-party vendor portfolio — including the HNDL and TNFL threat dimensions, Mosca's inequality vendor prioritization framework, emerging Quantum Security Posture Management and Quantum TRiSCM operating models, and the five quantum governance dimensions and trust KPIs that mature buyer programs are adopting. Quantum Risk Is Already Here: An Enterprise Buyer's Guide to Assessing Third-Party Cryptographic Readiness Before Q-Day, Part 2 — Assessment Framework and Deployment Guide (IDC #, forthcoming) delivers the complete 48-question Third-Party Quantum Encryption Readiness Assessment Framework. Vendors that cannot demonstrate a credible migration posture across both encryption and authentication represent material, unquantified risk in your third-party portfolio — risk that regulators and boards will increasingly require you to account for before formal mandates arrive.

"Two clocks are running simultaneously across your third-party vendor portfolio. The first is the HNDL clock: Data your vendors encrypt currently under quantum-vulnerable algorithms is potentially readable within a decade, and it cannot be re-encrypted retroactively. The second is the TNFL clock: Every artifact your vendors sign currently under a quantum-vulnerable key extends the attack surface adversaries will exploit once quantum computing reaches cryptographic relevance. Neither clock can be paused, and neither is your vendor's problem alone — because the data at risk is yours, and the regulatory accountability is yours. The only rational response is to treat third-party PQC assessment not as a future program but as the most time-sensitive addition to your vendor risk management framework — and to build the governance, assessment infrastructure, and continuous monitoring foundations before your regulators ask you to explain why you did not," says Philip D. Harris, CISSP, CCSK, research director, Governance, Risk, and Compliance Solutions at IDC.

Schneider Electric Acquires Cognite: Industrial AI Becomes an Architecture Decision for Manufacturers

Sarah Lee — Thu, 09 Jul 2026 04:00:00 GMT

Schneider Electric's announcement of the acquisition of Cognite marks an advancement in industrial AI infrastructure. By folding Cognite's industrial DataOps platform and Atlas AI agentic workbench into AVEVA, Schneider is placing a substantial bet that the next competitive advantage in manufacturing lies not in another analytics layer but in the data foundation beneath it. For process and discrete manufacturers across chemicals, food and beverage, automotive, pulp and paper, and semiconductors, this deal reshapes how AI will be deployed on the plant floor.